Aluminum substrate and glass fiber plate difference and applicationFirst, glass fiber board (FR4, single-sided, double-sided, multi-layer PCB circuit board, impedance board, blind buried hole board), suitable for computer, mobile phone and other electroni
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can be changed as follows: (1) the rheology of the patch glue. (2) The initial adhesive strength of the patch adhesive. (3) glue point contour. (4) glue point
Some measures can be taken to clean the tail of PCBA production and processing to improve work efficiency: 1. About 40pcs of PCB board shall be checked and signed by the quality engineer before the product comes off the line. 2. The operator or inform the
In PCBA processing, there are several process points in the whole process of rework and reflow: 1. Repair reflow welding curve should be close to the original welding curve. 2. In the reflux process, the heating temperature and time of each area should be
The following factors should be considered in the processing of PCBA capacitor components: first, the selection of capacitor voltage resistance, second, capacitance selection, third, capacitor medium selection,
Prevention can be carried out in the following ways: 1, moisture-proof storage of components, 2, choose well-known brand solder paste, 3, adjust printing parameters, 4, adjust reflow temperature curve, 5, try to use reflow welding, reduce manual welding,
The quality control of the whole pcba process is very important. 1.PCB circuit board manufacturing; 2.PCBA incoming components procurement and inspection; 3.SMT patch processing; 4. Plug-in processing, 5. Program burning, 6.PCBA board test
What are SMT patch, PCB circuit board, PCBA processing and DIP plug-in respectively? First, SMT is one of the basic components of electronic components, which is called surface assembly technology; second, PCB is the most important component of electronic
To repair and maintain the internal circuit board, the following maintenance methods are: 1, inspection components, 2, welding state analysis, 3, component direction detection, 4, tool inspection of parts, 5, startup test
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.
In the process of electronic machining, the smaller the Angle of the scraper affects the vertical force of the solder paste, the greater the vertical component of the force.
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