What are the PCBA board repair requirements?
PCBA processing common adverse phenomena: 1, warping, 2, short circuit, 3, offset, 4, missing parts, 5, air welding
PCBA processing common adverse phenomena: 1, warping, 2, short circuit, 3, offset, 4, missing parts, 5, air welding
PCBA processing of aluminum substrate manual soldering wire points for attention: first, pay attention to the welding temperature, two, select the appropriate raw materials, three, with the iron head is harmful to spot welding force
PCBA processing needs to do three requirements: first, the solder paste, must be stored in 5-10 degrees of environment. In order not to affect the use of solder paste, shall not be placed in the environment below zero, second, in the process of SMT proces
The silk screen position number does not determine whether the final patch is correct. Many experienced engineers found that deleting the bit number silk screen printing, PCBA product patch back and no problem. Generally, the machine patch locates the dev
In PCBA manufacturing, automatic optical detection is set at the last step of the SMT production line. After the SMT patch processing is completed, product defect detection is required. Through timely detection and reduction of defects, improve assembly e
The welding methods of PCBA: (1) split welding method: (2) centralized welding method: (3) residual welding method: (4) shear welding method
Small batch PCB proofing charge is high, mainly in SMT SMT processing, whether large batch SMT processing, small batch SMT processing, need to do the preliminary work is the same
Quick solution to PCBA short-circuit problem: 1. Use short-circuit positioning analyzer for inspection, 2. Light up the short-circuit network on the PCB diagram. 3. In case of the same short-circuit in batches, take a board to operate the secant line and
PCBA processing after welding reasons: one, the component plug-in close to the process side of the component plug-in position, two, the customer has special requirements of high sensitivity components, can not over wave soldering, three, components over t
PCBA processing to avoid PCB board warping method:1. Reduce the influence of temperature on plate stress; 2. Adopt high Tg plate; 3. Increase the thickness of the circuit board, 4. Reduce the size of the circuit board and reduce the number of pieces of th
PCB design layer number to consider the following problems: 1, use,2, required signal type,3, through hole type,4, required signal layer density and number,5, required plane number,6, manufacturing cost,7, delivery time,
Single-side backwelding boards are rarely used now, because double-side backwelding can save space on the circuit board, which means it can make the production smaller.