The main reasons for solder joint failure in PCBA processing are as follows: 1, component pin is bad: 2, PCB solder pad is bad: 3, solder quality defects: 4, solder quality defects: 5, process parameter control defects: 6, other auxiliary materials defect
Methods for rapid maintenance of faults after PCBA processing: one, visual inspection method, two, resistance method, three, voltage method, four, waveform method, five, current method, six, component replacement method, seven, step by step investigation
When the solder paste reaches the melting temperature, under the action of balanced surface tension, there will be a self-positioning effect, that is, when there is a small deviation from the component placement position, under the action of surface tensi
pcba electronic products processing process: one, customer data file, two, document review, three, technical preparation, four, material purchase and arrival, five, material inspection and machine, six, start production, seven, test and delivery
What is PCB, SMT, PCBA: 1, PCB is used to support electronic components, and provide lines, so that electronic components can form a complete circuit, 2, SMT is a popular technology, also known as surface mounting technology, 3, PCBA refers to the purchas
Why do PCBA circuit board inspection: PCBA inspection is a link in the whole production process of PCBA processing, is an important means to control product quality
PCBA processing using expired PCB board three hazards: 1, PCBA processing using expired PCB may cause oxidation of PCB surface welding pad, 2, PCBA processing using expired PCB may cause moisture absorption and burst board, 3, PCBA processing using expire
SMT surface mount technology has the following 5 steps: 1. PCB production - this is the actual production stage of PCB with solder points; 2. Deposit solder on the pad to fix the assembly to the plate; 3. With the help of the machine, the components are p
The reasons for the formation of tin beads in PCBA processing: 1. When the PCB board leaves the liquid solder, it is very easy to form tin beads, 2. The second reason for the formation of tin beads is the release of volatile substances in PCB board and so
Circuit board components testing skills: 1. Measure the polarity of each foot of the rectifier bridge, 2. Judge the quality of crystal vibration, 3. Unidirectional thyristor detection, 4. Polarity recognition of bidirectional thyristors, 5. Check the qual
Take a look at the PCBA OEM classification: 1. Technology-oriented, 2. Processing-oriented
PCB board temperature resistance test method: In order to ensure the quality of PCB board, it is necessary to carry out temperature resistance test, usually the highest temperature resistance of PCB board is 300 degrees, 5-10 seconds; Over lead-free wave
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