Design PCB multilayer circuit board lamination technology
PCB board path through single-sided, double-sided, multi-layer progress and improvement, and the proportion of PCB multi-layer board increased year by year.
PCB board path through single-sided, double-sided, multi-layer progress and improvement, and the proportion of PCB multi-layer board increased year by year.
Flexible circuit board design requirements to consider the flexible circuit board substrate, bonding layer, copper foil, covering layer and reinforcement plate and surface treatment of different materials, thickness and different combinations.
Soft and hard combined board, is flexible circuit board and traditional rigid circuit board, according to the relevant process requirements combined together, the formation of a circuit board with FPC characteristics and PCB characteristics.
Rigid and flexible bonded boards are not ordinary circuit boards. The process of combining thin layers of flexible and rigid substrates and then laminating them into individual components presents extraordinary challenges and opportunities.
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
The measurement method is to dissolve the sample in hot alcohol with titanium phenol as an indicator, titration required potassium hydroxide milligram number, namely its acid value.
Mainly undertake multi-layer, high density PCB design drawing board and circuit board design proofing business. Next, I will share with you the golden rules of PCB wiring.
Design the chip and integrate its digital and analog IP, and then optimize the placement of the chip in the package chosen and, in turn, the placement of the device on a multilayer PCB that is no longer sufficient.
The high-speed system Design and simulation product line provides a simulation platform for rapid modeling and passive parameter extraction of PCB board, component and system interconnection structure.
The main reason of electromagnetic interference caused by ground wire in PCB is the impedance of ground wire. When an electric current flows through a ground wire, a voltage is generated on the ground wire. This is ground noise. Driven by this voltage, a
Copper clad plate is the basic material of electronic industry, mainly used in the processing and manufacturing of printed circuit board (PCB), widely used in TV, radio, computer, computer, mobile phone, communication and other electronic products.
PCB copy board and chip, the two are more like the relationship between the lips and teeth, think about it carefully, PCB copy board is like the shelter of the chip, without the shelter, the chip can only wander around, and can not play their role.