Ultra-fine line etching process of PCB for next generation packaging technology
Circuit board system interconnection includes chip to circuit board, PCB board interconnection and signal input/output between PCB and external devices.
Circuit board system interconnection includes chip to circuit board, PCB board interconnection and signal input/output between PCB and external devices.
In the process of PCB high-speed signal circuit design and wiring, engineers need to shorten the lead between the pins of high-speed circuit devices as much as possible.
In the future, with the emergence of new demands for automotive electronics, data centers and artificial intelligence, PCB industry will usher in new growth points.
Each circuit layer in the multilayer circuit board is pressed together by the action of semi-cured sheet; Depending on the circuit design, some areas of the semi-cured sheet need to be cut and then pressed together.
the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.
Therefore, careful consideration should be given to the placement of ground wires in the layout. Mixing all kinds of ground will cause unstable power supply. The following points should be noted in the design of ground wire:
Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short
The parameters of PCB board layer, the distance between signal wires, the electrical characteristics of the driver and receiver end, and the connection mode of signal wires all have a certain influence on the crosstalk.
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
Defective sheeting requires special assembly procedures. If the end-of-life unit board (x-out) is not clearly marked, or it is not isolated from the sheeting, the known defective board may be assembled, wasting parts and time.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.
these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig