Precautions for PCB baking
The dielectric constant of substrates and prepreg materials using epoxy glass can be controlled by changing the percentage of resin content.
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Design performance requirements of PCB multi-substrate
In order to minimize the chance of PCB board distortion and obtain a flat finished board, the layering of the multi-substrate board should be kept symmetrical.
Why should expired PCB be baked before SMT or furnace?
a large number of pre-test printing solder paste production several pieces to determine no solder problems before continuing to production.
High speed PCB design
The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.
Design of controllability and electromagnetic compatibility of high speed PCB
There is a little bit of short circuiting between digital and analog, but note that there is only one connection point. There are also differences on the PCB, which is determined by the system design.
Methods of eliminating crosstalk in PCB design
The size of inductive crosstalk depends on the proximity of two loops, the size of the loop area, and the impedance of the load affected.
Research on high frequency PCB anti-interference sharing
In the actual study, we can conclude that there are four main interference, including power supply noise, transmission line interference, coupling and electromagnetic interference (EMI). Through analyzing various interference problems of high frequency PC
What is the function of PCB board printed circuit surface plating process
the current motherboard, memory and graphics card and other equipment "gold finger" is almost all made of tin material, only part of the high performance server/workstation accessories contact point will continue to use gold plating, the price i...
Hd understand the basic architecture of tight HDI board PCB
With the introduction of surface mount technology, automatic detection technology of circuit board is applied, and the packaging density of circuit board increases rapidly.
Prevent PCB will expire, and the disposal method after expiration
depending on the thickness of the gold layer, if the thickness is thin, the nickel layer may appear in the gold layer due to diffusion and oxidation, affecting the reliability, not inadvertently.
PCB "over hole cover oil" and "over hole open window", stupid can't distinguish?
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design! At this point in time,
Why should the PCB board be blocked?
This process can ensure that the oil cover through the hole is good, the plug hole is smooth, the wet film color is consistent, the hot air leveling can ensure that the through hole is not tin, no tin beads in the hole, but it is easy to cause the ink pad
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