Even if the oxidation after a long time of use will almost only occur in the insertion and removal of the connection part, and there is no impact on the welding pad and the welded components.
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.
In addition, before the solder resistance film coating, the printed circuit board surface is treated by plasma, and a certain roughness and high activity surface can be obtained, so as to improve the adhesion of the solder resistance film.
Now the production of gold plate is rarely, in the actual trial process, 90% of the gold plate can be replaced by gold plate sinking gold plate, gold plate welding poor is his fatal shortage, is also the direct cause of Princecircuit to give up gold plate
The parasitic capacitance through the hole can cause the signal rise time to be prolonged and the transmission speed to be slowed down, thus deteriorating the signal quality.
It is difficult to use this process to control the production, so process engineers must adopt special flow and parameters to ensure the quality of the plug hole.
The chemical residue in the gold settling process can be left in the hole where the plug hole is not sufficient, causing problems such as weldability.
There is no significant relationship between the generation of bulge and construction area, the same area some severe, some light, some intact.
The advantage of performing reception equalization in standalone devices is that it provides optimal wiring advantage and design flexibility.
The current approach is to increase the distance between the two signal layers and make the lines of the two layers as vertical as possible to avoid signal crosstalk between layers.
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