Why are PCB design layers mostly even?
the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.
the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.
It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
Choose as large a component as possible when designing the power resistance, and adjust the layout of the printed board to allow enough space for heat dissipation.
there are still some differences between high frequency products and high speed products in the demand for plate.
TPM and other high-end knowledge, but ignore the field management, ignore the most basic production activities of the people and equipment.
The following is its structure diagram (about circuit symbols and functions will be explained later) :IC design: CMOS devices and their circuits,
it will also lead to insufficient bonding force between copper foil and substrate after laminate, resulting in positioning (only for the large plate) or sporadic copper wire loss, but the stripping strength of copper foil near the stripping line will not
The layout of the basic structure such as PAD, design rule check (DRC), parameter extraction (EXT) and layout circuit control (LVS) associated with the design tool are the key to the successful production of the designed chip in the wafer factory. This is
A tin or lead tin resist covering the top of the line extends to both sides, forming a "rim" that covers a small portion of the sensitive film underneath the "rim".
Under normal circumstances, the electronic products we use are made of pcb plus a variety of capacitors, resistors and other electronic components designed according to the circuit diagram
In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, it is necessary to take a variety of technical measures to prevent.