Hd understand the basic architecture of tight HDI board PCB
The inner laser hole needs to be electroplated and filled, and then the outer laser hole is made. The price is more expensive than the error hole.
The inner laser hole needs to be electroplated and filled, and then the outer laser hole is made. The price is more expensive than the error hole.
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In addition to the gold-plated copper foil at the lower left corner in the figure above, BGA packaging also uses the missing corner and concave points and silk screen dots to indicate the direction of the first foot.
This simple statement connects the common sense of capacitance with the newly discovered theory of characteristic impedance.
The development of the electronics industry also promotes the development of PCB, which also puts forward higher requirements for the production process and surface mounting technology of printed board.
the traditional aluminum sheet plugging process is changed, and the plate surface welding and plugging are completed with white mesh. Stable production and reliable quality.
Silver immersion does not have the good physical strength of electroless nickel/gold plating because there is no nickel underneath the silver layer. In addition, silver immersion has good storage, after several years of assembly will not have a big proble
The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design!
In the real world, in addition to considering signal quality, power source plane coupling (using adjacent ground planes to reduce AC impedance of the power plane) and layered symmetry are all factors to be considered.
When selecting the driver chip, in addition to ensuring that it basically matches the load and that the signal edge meets the requirements (generally, the clock is an effective signal along the clock), the time delay of the clock in the driver chip should
one is that two lines walk on the same layer (side-by-side), the other is that two lines walk on two adjacent layers (over-under). Generally, there are many ways to implement the former side-by-side.