PCB copper foil supply after chip shortage
A persistent semiconductor shortage is rapidly snowballing into a full-blown component shortage, underscoring the fragility of the current supply chain.
A persistent semiconductor shortage is rapidly snowballing into a full-blown component shortage, underscoring the fragility of the current supply chain.
High speed devices are particularly sensitive to this, and will thus receive high speed false signals, while low speed devices will ignore such false signals.
The reflection of the signal back to the signal source will increase the system noise, making it more difficult for the receiver to distinguish the noise from the signal,
In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.
When we combine the forward - clock - oriented field and the reverse - clock - oriented field, the effect of elimination can be produced.
The above examples can help us understand Maxwell equations and PCB routing, and they are illustrated by very simple mathematical formulas.
In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux
as PCB substrate epoxy resin (see the column of PCB substrate resin chapter), PCB substrate reinforcement materials, copper foil and other manufacturing technologies have not realized commercial production.
Otherwise, you may be forced to make modifications and redesign your PCB stack structure.
In addition, with the increase of width, PCB current-carrying capacity does not increase strictly in line with the linear increase
This will break the solder joints, bend the shape of the board, or it may cause the copper thread on the board to break.
This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.